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Our Flexible Printed Circuit Board Capabilities
Common Capabilities
- Polyimide Films - 0.5 mil (0.0005”), 1 mil (0.001”), 2 mils (0.002”), 3 mils (0.003”), 5 mils (0.005”), and 12 mils (0.012”)
- Thermo-Bond Adhesives - Acrylic/Modified Acrylic and Modified Epoxy
- Copper Foils (Rolled-Annealed) - 1/4 oz., 1/3 oz., 1/2 oz. (0.0007”), 1 oz. (0.0014”), and 2 oz. (0.0028”)
- Stiffeners - FR-4, Polyimide, Metal, or Customer-Supplied
- FR-4 in Multilayer Flex Circuits - Laminated to the Flex Circuit to Create Rigid-Flex Boards, Typically with Vias
- Surface Finish - Solder (Hot Air Leveling or Electrolytic Plating), Electroless Au and Ni, Silver, and Tin Plating
- Other Materials or Finishes - Speak with Us Concerning Your Special Requirement
FEATURE | SPECIAL PROCESSES | STANDARD | |
Minimum Copper Trace/Space | 0.25 oz. (9 µm)
0.33 oz. (12 µm)
0.5 oz. (18 µm)
1 oz. (35 µm) | 0.001”/0.0015”
0.0015”/0.0015”
0.002”/0.002”
0.003”/0.003” | 0.0015”/0.002”
0.002”/0.002”
0.0025”/0.0025”
0.0035”/0.0035” |
Minimum Via Hole Diameter | NC Drill
UV Laser | 0.003”
0.002” | 0.006”
0.004” |
Minimum Blind Via Diameter | UV Laser | 0.004” | 0.006” |
Layer to Layer Artwork Registration | Double-Sided | 0.001” | 0.004” |
Trace to Edge Tolerance | NC Route
UV Laser | N/A
0.001” | 0.005”
0.001” |
Insulator Positional Tolerance | Cover Film
LPI | 0.001”
0.001” | 0.003”
0.002” |
Minimum Cover Layer Opening | 0.5 mil (12 µm)
1 mil (25 µm) | 0.0005”
0.001” | 0.001”
0.002” |
Cover Layer Adhesive Bleed | 0.5 mil (12 µm)
1 mil (25 µm) | 0.0005”
0.001” | 0.001”
0.002” |
Minimum Cover Layer Webbing Width | 0.5 mil (12 µm)
1 mil (25 µm) | 0.004”
0.006” | 0.004”
0.006” |